About OCENME: a power semiconductor supplier built around packaging

What the company actually does

Three activities, in order of how much they affect what a customer receives:

1. Device definition and die selection We specify voltage class, on-resistance, gate charge and package, then select die from qualified foundries and qualify the combination. R&D spending was CNY 10 million in 2024, and 5.6% of revenue in 2023.
2. Packaging and test Die attach, wire bonding, moulding, trim and form, 100% electrical test and marking on automated lines. This is the operation that decides reliability, and it is the part we own end to end.
3. Reliability and failure analysis Nine test types in-house to JESD22 methods, with X-ray, C-SAM, die shear, wire pull and microscopy for analysis. Reports are issued per part number and lot.

What the company does not do

We do not fabricate wafers, so we do not claim a proprietary wafer process. We do not hold IATF 16949, we do not claim AEC-Q101 qualification, and we do not submit PPAP packages. We do not supply IGBT modules or 1200 V SiC devices — discrete IGBTs are part of the broader portfolio stated in our product catalogue, but selection data is confirmed per ordering code at RFQ rather than published. Each of those is a real limitation, and stating it early is cheaper for both sides than discovering it during an audit.

Milestones

1. 2011 Company founded in Shenzhen Shenzhen Hexin Electronics Co., Ltd. is established, focused on the design, sales and service of power semiconductor products and accessories.
2. 2016 Product portfolio extended to SiC and IGBT The catalogue grows from silicon MOSFETs and rectifiers to include silicon carbide MOSFETs and IGBT discretes, following customer demand from power supply and welding applications.
3. 2021 Automated packaging plant commissioned A fully automated assembly plant is built for die attach, bonding, moulding and test, moving packaging in-house instead of relying entirely on third-party assembly houses.
4. 2023 R&D spending reaches 5.6% of revenue Research and development investment is reported at 5.6% of annual revenue, up 0.3 percentage points year on year.
5. 2024 Capacity expansion and CNY 10 million R&D Packaging equipment is expanded, taking stated capacity to 50 million units per month, with R&D investment of CNY 10 million for the year.
6. 2026 English catalogue and English-language technical site Datasheets, selection guidance and the export enquiry process are published in English for power supply, lighting, welding and solar customers outside China.

Credentials

The quality system is ISO 9001:2015, covering design, assembly and test of power semiconductor devices, with SGS environmental test reporting on packaged product. The company is also recognised as a National High-Tech Enterprise and as a Shenzhen Specialised & Innovative SME. Certificate numbers are confirmed on request rather than published, because a lapsed certificate on a website is worse than no certificate at all.

How the plant is run

Production is managed digitally end to end: ERP, MES, WMS and CRM systems link customer orders to wafer lots, work orders and shipping cartons, so traceability is a database query rather than a paper chase. The engineering R&D centre works on device definition, new package development — including compact DFN and QFN outlines for space-constrained designs — and application support. The company holds more than 40 granted invention patents and utility models across semiconductor development, manufacturing and test.

Stated direction from the company charter: the vision is to become a mainstream global power semiconductor manufacturer; the quality policy is full participation, continuous improvement, dedicated service and brand building.