Manufacturing Knowledge Base

Reference material for engineers and buyers sourcing machined components: tolerances that hold in practice, what actually drives price, and where a design choice costs 30% more than it needs to.

What this library covers

This library answers the questions that arise before a purchase order: what a tolerance value actually means, which material grade suits an application, how supplier capability should be verified, and which design features add cost without adding function. Every article states its scope and its limits, because a definition that pretends to cover everything is not useful for a decision.

Fundamentals · Nov 14, 2026

What Is a Power MOSFET? Definition and Use

A power MOSFET is a voltage-controlled switch for currents above 1 A. How the structure works, what RDS(on) costs, and which voltage class fits which circuit.

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Selection · Nov 13, 2026

How to Read a MOSFET Datasheet Without Being Misled

The six numbers that decide whether a MOSFET works in your circuit, and four ways datasheets flatter a part: conditions, temperature, sampling and axes.

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Comparison · Nov 12, 2026

MOSFET, IGBT or SiC: Which Switch to Choose

A decision guide by voltage, current and frequency, with the crossover points where each technology wins and the losses that decide them.

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Comparison · Nov 11, 2026

Super Junction vs Planar MOSFET

Super junction MOSFETs cut on-resistance by 3–5×, but their non-linear Coss and sharp edge change EMI, light-load efficiency and avalanche behaviour.

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Comparison · Nov 10, 2026

SiC Schottky vs Fast Recovery Diode

SiC Schottky diodes remove reverse recovery but leak more and cost more. Where the crossover sits, and why below 20 kHz a silicon FRD is usually the better buy.

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Reliability · Nov 9, 2026

Why Power Supplies Fail in the Field

Most field failures trace to six causes, none of them the device headline rating. What to test, and what evidence to demand from a supplier.

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Sourcing · Nov 8, 2026

Qualifying a Second-Source Power Device

A six-step second-source process: define the envelope, compare at matched conditions, verify on a batch, stress it, document it, then keep watch.

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Reliability · Nov 7, 2026

HTRB vs H3TRB: What Each Test Proves

Both stress a device at high temperature with reverse bias. The humidity is the difference, and it is the difference between a dry failure mode and a wet one.

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Looking for a single definition rather than an article? The manufacturing glossary defines 20 core terms in one page, and the FAQ covers commercial questions such as MOQ, lead time and shipping terms.

Send the part number and the operating conditions

Tell us the voltage class, current, switching frequency and what the device is replacing. You will get a datasheet, a parameter comparison at matched conditions, and a quotation with MOQ and lead time.