Questions that arrive before a purchase order

Send the full part number, package and operating conditions. We compare voltage class, on-resistance at your gate voltage, gate charge, output capacitance and body diode behaviour at matched conditions, then quote only where the comparison holds. A voltage and current rating alone does not establish a replacement.

Not in the current datasheet set. Our silicon MOSFETs run to 700 V and SiC to 800 V. Above 900 V the practical answer is silicon carbide, and we say so rather than stretching an 800 V part into a higher-voltage design.

IGBT is listed in our product direction, but the knowledge base does not contain complete per-type IGBT parameters, so we do not publish specific IGBT ratings. Ask with your application and we will confirm what can be quoted rather than inventing a table.

No. We package die from qualified foundries; we do not sell wafers or bare die, and we do not offer wafer-level packaging such as WLCSP or flip chip.

MOQ is set per ordering code and packing format — a tape-and-reel quantity differs from a tube quantity — and is confirmed in the quotation rather than published as a blanket number. Sample quantities for evaluation are available before a production order.

Lead time depends on whether the part is in stock, in a current production run, or needs a new packaging lot, and it is confirmed against the production plan with the quotation. We do not publish a single number that applies to every part.

A certificate of conformance, the electrical test record for the lot, and the datasheet for the ordering code. Reliability reports are supplied per part number on request. A packing list and commercial invoice accompany export shipments.

Yes, for production volume, with a marking approval step: you approve the marking drawing, we build a sample lot, you sign off, then volume starts. A marking change is a documented change with a first-article record.

No. We hold ISO 9001:2015 and do not claim AEC-Q101, PPAP or IATF 16949. If your programme requires those, that is a supplier-selection criterion we will not meet, and saying so at the enquiry stage is cheaper than an audit.

Nine types in-house to JESD22 methods: HTRB, H3TRB, HT/HU, high-temperature storage, temperature cycling, thermal shock, solderability, RSH and HPC. Failure analysis uses X-ray, C-SAM, die shear, wire pull and optical microscopy.

Every unit is electrically tested for breakdown, on-resistance, threshold voltage and leakage before marking. Dynamic parameters such as Trr and Qrr are characterised per die lot rather than 100% tested, because they need a defined di/dt and cost throughput. Both statements are in the datasheet notes.

Yes, by PCN before shipment, covering die source, mould compound, lead frame supplier and assembly site, with the qualification evidence and effective date. A silent die change is the most common cause of a field failure that cannot be reproduced.

No. We are fab-lite: die come from qualified foundries, and we handle device definition, packaging, test and reliability in Shenzhen. We do not claim a proprietary wafer process or a 100% in-house supply chain.

Yes, by appointment and under NDA. Remote video walkthroughs of the assembly, test and reliability areas are available for a first screening. Audits of foundry partners are separate and depend on their visitor policies.

From Shenzhen, China. Standard terms are EXW Shenzhen or FOB Shenzhen, with CIF and DDP available for customers who prefer a landed cost. Payment terms are confirmed per order.

Shenzhen Hexin Electronics Co., Ltd. (深圳市和芯电子有限公司), founded 2011. OCENME is the brand used on products and documentation.